Soft thermally conductive silicone pad that fills the gap between components and heat sinks, thermal conductivity 1.5–6 W/mK.
Room-temperature curing two-component thermal adhesive for power modules and batteries.
Tản nhiệt cho CPU, mô-đun công suất IGBT, đèn LED, bộ nguồn và thiết bị điện tử ô tô
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