01 / 10, 2026
Lead-free solder paste for fine-pitch parts
Type 5 fine-powder paste reduces bridging and voids on 0201 and fine-pitch BGA parts.
Key points
Every line has its own conditions: temperature, humidity, substrates and takt time. AMS engineers survey the site to recommend the right materials for semiconductors.
- Material consulting
- Free samples
- On-site technical support
Call 039.89.89.333 for technical documents and a detailed quotation.
Developing a power board, sensor or LED module that needs protection? Send us the operating conditions and AMS will propose suitable materials and samples.
